| S.No | Title | Document |
|---|---|---|
| 1. | Revised Guidelines for effective functioning of the Modified scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors Fab/ Discrete Semiconductors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP)/ Outsourced Semi | - |
| 2. | Modified Semicon India Program | - |
| 3. | Modified Scheme for setting up of Semiconductor Fabs in India | - |
| 4. | Modified Scheme for setting up of Display Fabs in India | - |
| 5. | Modified scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors Fab/ | - |
| 6. | Design Linked Incentive Scheme | - |
| 7. | Guidelines for Modified Scheme for setting up of Semiconductor Fabs in India | - |
| 8. | Guidelines for Modified Scheme for setting up of Display Fabs in India | - |
| 9. | Guidelines for Design Linked Incentive Scheme | - |
| 10. | Threshold and Ceiling Limits | - |
| 11. | Required List of Enclosures | - |
| S.No | Title | Document |
|---|---|---|
| 1. | Guidelines for Scheme for setting up of Display Fabs in India | - |
| 2. | Guidelines for Scheme for setting up of Semiconductor Fabs in India | - |
| 3. | Guidelines for effective functioning of the Scheme for setting up ofCompound Semiconductors / Silicon Photonics / Sensors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP) / OSAT facilities in India | - |
| 4. | Guidelines for effective functioning of the Modified scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors Fab/ Discrete Semiconductors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP)/ Outsourced Semiconducto | - |
| 5. | Scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP) /OSAT facilities in India | - |
| 6. | Scheme for setting up of Display Fabs in India | - |
| 7. | Scheme for setting up of Semiconductor Fabs in India | - |